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TE Connectivity Rounds Out LGA 3647 Socket Product Line

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TE Connectivity Rounds Out LGA 3647 Socket Product Line

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TE Connectivity announced its complete LGA 3647 socket and hardware product line solutions are now available. These products are designed for Intel Corporation's new processors specified under their new server platforms. TE's LGA sockets and hardware together provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). The LGA 3647 socket is the first LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability in connectivity for large processors.

Hong Kong, Asia, July 04, 2017 /PressReleasePing/ - TE Connectivity announced its complete LGA 3647 socket and hardware product line solutions are now available. These products are designed for Intel Corporation's new processors specified under their new server platforms. TE's LGA sockets and hardware together provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). The LGA 3647 socket is the first LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability in connectivity for large processors.

TE's LGA 3647 product line includes the LGA 3647 P0 and socket P1 which are compatible with Intel's latest processors, a clip/carrier that provides better alignment and keeps fingers away from the socket contact field, a bolster plate provides orientation and alignment for PHM and the spring load force necessary for socket loading, and a back plate which provides mounting points for the bolster plate assembly. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry's leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical products.

About Heilind Electronics: Founded in 1974, Heilind Electronics, Inc. (http://www.heilind.com) is one of the world's leading distributors of connectors, relays, switches, thermal management & circuit protection products, terminal blocks, wire & cable, wiring accessories and insulation & identification products. Heilind has over 40 facilities in the United States, Canada, Mexico, Brazil, Germany, Hong Kong, Singapore and China.

Heilind Asia Pacific (http://www.heilindasia.com) commenced operations in Dec 2012, and now has 19 locations throughout Asia. Its industry leading service offering to customers in Asia Pacific is the result of a commitment to the belief of “Distribution As It Should Be?

About TE Connectivity: TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today's increasingly connected world. We collaborate with engineers to transform their concepts into creations ?redefining what are possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS ?www.TE.com.

TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. Intel is a trademark. Other logos, product(s) and/or company names might be trademarks of their respective owners.

Press Contact: sarah luo Heilind Asia Pacific RM 1707-10,DELTA HOUSE,3 ON YIU ST 26119634 http://www.heilindasia.com/
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TE Connectivity Rounds Out LGA 3647 Socket Product Line TE Connectivity announced its complete LGA 3647 socket and hardware product line solutions are now available. These products are designed for Intel Corporation's new processors specified under their new server platforms. TE's LGA sockets and hardware together provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). The LGA 3647 socket is the first LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability in connectivity for large processors.

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